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Elmet Technologies

Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material
Categories: Polymer; Thermoplastic
Material Notes: SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The SYRON products possess impressive chemical and radiation resistance.

Features and Benefits:

  • High maximum operating temperature - suitable for applications where high temperature stability is required
  • Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments
  • Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity
  • 1/2 oz. (18 micron) very low profile electrodeposited copper foil cladding

Typical Applications:

  • Flex-to-install applications
  • Lightweight feed manifolds
  • Automotive sensors
  • Conformal circuitry
  • Oil and gas exploration
  • Airborne lightning strike protection

Information provided by Rogers Corporation.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Moisture Absorption at Equilibrium  0.050 %
@Thickness 0.0508 mm		0.050 %
@Thickness 0.00200 in		D24/23; IPC-TM-650 2.6.2.1
 0.15 %
@Thickness 0.0508 mm		0.15 %
@Thickness 0.00200 in		D48/50; ASTM D570
 0.21 %
@Thickness 0.102 mm		0.21 %
@Thickness 0.00400 in		D24/23; IPC-TM-650 2.6.2.1
 0.32 %
@Thickness 0.102 mm		0.32 %
@Thickness 0.00400 in		D48/50; ASTM D570
Thickness 50.8 - 102 microns2.00 - 4.00 mil
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength  190 MPa
@Thickness 0.102 mm		27600 psi
@Thickness 0.00400 in		RT; ASTM D638
 216 MPa
@Thickness 0.0508 mm		31300 psi
@Thickness 0.00200 in		RT; ASTM D638
Tensile Modulus  7.86 GPa
@Thickness 0.102 mm		1140 ksi
@Thickness 0.00400 in		RT; ASTM D638
 11.5 GPa
@Thickness 0.0508 mm		1670 ksi
@Thickness 0.00200 in		RT; ASTM D638
Peel Strength  1.09 kN/m
@Thickness 0.0508 mm		6.20 pli
@Thickness 0.00200 in		IPC-TM-650 2.4.8
 1.10 kN/m
@Thickness 0.102 mm		6.30 pli
@Thickness 0.00400 in		IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+16 ohm-cm
@Thickness 0.102 mm		1.00e+16 ohm-cm
@Thickness 0.00400 in		Condition A; IPC 2.5.17.1
Surface Resistance 1.00e+12 ohm
@Thickness 0.102 mm		1.00e+12 ohm
@Thickness 0.00400 in		Condition A; IPC 2.5.17.1
Dielectric Constant  <= 3.39
@Thickness 0.102 mm,
Frequency 1e+10 Hz		<= 3.39
@Thickness 0.00400 in,
Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5
 <= 3.61
@Thickness 0.0508 mm,
Frequency 1e+10 Hz		<= 3.61
@Thickness 0.00200 in,
Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5
Dielectric Strength  89.4 kV/mm
@Thickness 0.102 mm		2270 kV/in
@Thickness 0.00402 in		Z Direction; IPC-TM-650 2.5.6.2
 102 kV/mm
@Thickness 0.0508 mm		2580 kV/in
@Thickness 0.00200 in		Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor  <= 0.0050
@Frequency 1e+10 Hz		<= 0.0050
@Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5.1
 <= 0.0060
@Frequency 1e+10 Hz		<= 0.0060
@Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.5 µm/m-°C
@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C		9.17 µin/in-°F
@Thickness 0.00200 in,
Temperature 32.0 - 302 °F		X-Direction; IPC-TM-650 2.1.41
 18.0 µm/m-°C
@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C		10.0 µin/in-°F
@Thickness 0.00200 in,
Temperature 32.0 - 302 °F		Y-Direction; IPC-TM-650 2.1.41
 19.0 µm/m-°C
@Thickness 0.102 mm,
Temperature 0.000 - 150 °C		10.6 µin/in-°F
@Thickness 0.00400 in,
Temperature 32.0 - 302 °F		X-Direction; IPC-TM-650 2.1.41
 21.0 µm/m-°C
@Thickness 0.102 mm,
Temperature 0.000 - 150 °C		11.7 µin/in-°F
@Thickness 0.00400 in,
Temperature 32.0 - 302 °F		Y-Direction; IPC-TM-650 2.1.41
 57.0 µm/m-°C
@Thickness 0.0508 mm,
Temperature 0.000 - 150 °C		31.7 µin/in-°F
@Thickness 0.00200 in,
Temperature 32.0 - 302 °F		Z-Direction; IPC-TM-650 2.1.41
 76.0 µm/m-°C
@Thickness 0.102 mm,
Temperature 0.000 - 150 °C		42.2 µin/in-°F
@Thickness 0.00400 in,
Temperature 32.0 - 302 °F		Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°FASTM C518
Maximum Service Temperature, Air >= 210 °C>= 410 °Fpending UL RTI
Glass Transition Temp, Tg  172 °C
@Thickness <=0.0508 mm		342 °F
@Thickness <=0.00200 in		TMA; ASTM D3850
 176 °C
@Thickness <=0.102 mm		349 °F
@Thickness <=0.00400 in		TMA; ASTM D3850
Flammability, UL94  V-0
@Thickness 0.0508 mm		V-0
@Thickness 0.00200 in		pending
 V-0
@Thickness 0.102 mm		V-0
@Thickness 0.00400 in		pending
 
Descriptive Properties
Dimensional Stability-0.01 mm/mY-CMD; IPC-TM-650, 2.4.39A; 150°C bake; 0.004"
 -0.025 mm/mX-MD; IPC-TM-650, 2.4.39A; 150°C bake; 0.004"
 0.03 mm/mX-MD; IPC-TM-650, 2.4.39A; 150°C bake; 0.002"
 0.037 mm/mY-CMD; IPC-TM-650, 2.4.39A; 150°C bake; 0.002"
T260pass
Thermal Coefficient of Dielectric Constant9 ppm/°CIPC-TM-650 2.5.5.5; -100°C to 250°C; Z-Direction
Time to Delamination (T-288)pass

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