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Rulon Bearings

Premix Thermoplastics PREBOARD E1026 Standard Epoxy Circuit Boards
Categories: Polymer; Thermoset; Epoxy
Material Notes: PREBOARD is a thermoplastic based PCB laminate. Low dissipation factor leads to high gain in the antennas. As a non filled laminate PREBOARD is fully homogenous so that consistant properties are achieved through the whole panel even at high frequencies. Temperature stability in processing and long term stability in service at elevated temperatures are good. It also has low moisture absorption. PREBOARD is offered as custom sized panels according to customer specifications. Also thin films made of the same material are available and marketed under the name PREFLEX. Thus the same material can also be used in rigid/flex boards. The material lends itself also well for injection moulding and is available for that purpose in granules sold under the name PREPERM. This enables the production of 3D circuit boards to customer specification. Normally low temperature solders are recommended. Soldering with standard non lead solders has been demonstrated with fixtures.
    Key features:
  • Low and stable dissipation factor
  • Low and stable dielectric constant
  • Low water absorption
  • High Tg
  • Recyclable and RoHS compliant
  • Easier to process than PTFE
  • Good thermal resistance
  • Low CTE in all directions
  • Flame retardant UL 94-V0

    Applications: cellular phone base stations, cell phone antenna frames and similar antennas and other RF and microwave devices. Also halogen free flame retardant UL-V0 grade is available.

    Information from Premix OY
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.06 g/cc0.0383 lb/in³ASTM D792
Water Absorption 0.40 %0.40 %TM650 2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 55.0 MPa7980 psiISO 527
Tensile Modulus 2.30 GPa334 ksiISO 527
Flexural Modulus 2.20 GPa319 ksiISO 178
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+8 ohm-cm2.00e+8 ohm-cmTM650 2.5.17.1
Surface Resistance 2.00e+8 ohm2.00e+8 ohmTM650 2.5.17.1
Dielectric Constant 2.6
@Frequency 1.00e+9 - 1.00e+10 Hz		2.6
@Frequency 1.00e+9 - 1.00e+10 Hz		TM650 2.5.5.9
Dissipation Factor 0.0020
@Frequency 1.00e+9 - 1.00e+10 Hz		0.0020
@Frequency 1.00e+9 - 1.00e+10 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 50.0 µm/m-°C27.8 µin/in-°F
Heat Distortion Temperature 195 °C383 °F
Glass Transition Temp, Tg 197 °C387 °FTM650 2.4.25
 210 °C410 °F
Flammability, UL94 V-0V-0
 
Descriptive Properties
Copper Peel Strength (N/mm)1IPE-TM650 2.4.8
Dimensional Stability (%)<0.2150°C/2h

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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