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Rulon Bearings

Rogers Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:
  • Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greater
  • High Copper Peel Strength allows for thinner etched line widths
  • Lowest insertion loss available
  • Larger Panel sizes available
  • Low moisture absorption
  • Excellent CTE values lead to high reliability ceramic component attachment and PTH reliability

Benefits:

  • Mechanically strong
  • Greater dimensional stability than other 10 Dk products
  • Circuit miniaturizations leads to weight savings
  • Heat Dissipation and Management
  • Greater signal integrity
  • Cost-effective board layout and board processing
  • Low loss in humid environments

Typical Applications:

  • Ideal for X-band and below
  • Radar modules and manifolds
  • Aircraft Collision Avoidance Systems (TCAS)
  • Ground Based Radar Surveillance Systems
  • Miniaturized Circuitry & Patch Antennas
  • Power Amplifiers (PAs)
  • Low Noise Amplifiers (LNAs)

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 3.20 g/cc0.116 lb/in³ASTM D792 Method A
Water Absorption 0.030 %0.030 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F		NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 29.6 MPa4300 psiCross; IPC TM-650 2.4.18.3
 35.2 MPa5100 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 1.38 GPa200 ksiIPC TM-650 2.4.18.3
Flexural Strength 51.7 MPa7500 psiCross; IPC TM-650 2.4.4
 68.3 MPa9900 psiMachine; IPC TM-650 2.4.4
Compressive Modulus >= 2.93 GPa>= 425 ksiASTM D3410
Poissons Ratio 0.160.16ASTM D3039
Peel Strength >= 2.10 kN/m>= 12.0 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 2.38 kN/m13.6 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.36e+13 ohm-cm5.36e+13 ohm-cmE24/125; IPC TM-650 2.5.17.1
 1.40e+15 ohm-cm1.40e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.16e+14 ohm3.16e+14 ohmE24/125; IPC TM-650 2.5.17.1
 1.80e+15 ohm1.80e+15 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 10.2
@Frequency 1e+10 Hz		10.2
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
Dielectric Strength 24.5 kV/mm622 kV/inIPC TM-650 2.5.6.2
Dielectric Breakdown >= 45000 V>= 45000 VIPC TM-650 2.5.6
Dissipation Factor 0.0023
@Frequency 1e+10 Hz		0.0023
@Frequency 1e+10 Hz		may vary by thickness; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 8.00 - 10.0 µm/m-°C
@Temperature 50.0 - 150 °C		4.44 - 5.56 µin/in-°F
@Temperature 122 - 302 °F		IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 20.0 µm/m-°C
@Temperature 50.0 - 150 °C		11.1 µin/in-°F
@Temperature 122 - 302 °F		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.810 W/m-K5.62 BTU-in/hr-ft²-°FASTM E1461
Decomposition Temperature >= 500 °C>= 932 °F5 percent; IPC TM-650 2.4.24.6
 >= 500 °C>= 932 °FOnset; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-380IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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