Aptek 2100-A7C/B Low modulus urethane staking compound

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Aptek 2100-A7C/B Low modulus urethane staking compound
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2100-A7C/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties. 100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Exceeds NASA outgassing requirements for high vacuum environments APTEK 2100-A7C is a translucent, filled polyol resin. APTEK 2100-B is a yellow/orange, organic isocyanate. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Original Value	Comments

Density	0.990 g/cc	A Component; ASTM D1475
	1.21 g/cc	B Component; ASTM D1475
Viscosity	35 cP	B Component; ASTM D1824
Outgassing - Total Mass Loss	0.38 %	Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material	0.030 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Original Value	Comments
Hardness, Shore A	55	Cured property; ASTM D2240
Tensile Strength, Ultimate	400 psi	Cured property; ASTM D412
Elongation at Break	265 %	Cured property; ASTM D412

Electrical Properties	Original Value	Comments
Volume Resistivity	5.30e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.5 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	>= 360 V/mil	Cured property; 0.1 inch; ASTM D149
Dissipation Factor	0.030 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Original Value	Comments
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 1; JMTP P200
	185 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg	-70.0 °C	Cured property; JMTP 200
Flash Point	>= 150 °C	A Component; ASTM D92
	>= 150 °C	B Component; ASTM D92

Processing Properties	Original Value	Comments
Processing Temperature	80.0 °C	Cure 5 hrs + 2 hrs at RT
	100 °C	Cure 3 hrs + 2 hrs at RT

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