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Elmet Technologies

Aptek 2205 A/B Low modulus urethane stacking compound
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: APTEK 2205-A/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2205-A/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.

Good wet strength holds components in place allowing for the movement of the circuit boards during processing; 100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Available at two levels of reactivity to meet various productivity needs; available in pre-weighted kits to minimize handling time; ideal for field repair operations

APTEK 2205-A is a filled polyol resin that is safe to handle when used properly.. APTEK 2205-B is an organic isocyanate which make cause severe eye and skin irritation with direct contact..

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesMetricEnglishComments
Density 0.990 g/cc0.0358 lb/in³A Component; ASTM D1475
 1.21 g/cc0.0437 lb/in³B Component; ASTM D1475
Viscosity 88 cP88 cPB Component; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 6565Cured property; ASTM D2240
Tensile Strength, Ultimate 6.03 MPa875 psiCured property; ASTM D412
Elongation at Break 265 %265 %Cured property; ASTM D412
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.30e+15 ohm-cm1.30e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.030
@Frequency 1000 Hz
0.030
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  79.0 µm/m-°C
@Temperature 20.0 °C
43.9 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; JMTP P200
 185 µm/m-°C
@Temperature 20.0 °C
103 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg -70.0 °C-94.0 °FCured property; JMTP P-200
Flash Point >= 125 °C>= 257 °FB Component; ASTM D92
 >= 150 °C>= 302 °FA Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 85.0 °C185 °FCure 4 hrs

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