Aptek 2120 PMF Low modulus urethane staking compound

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Aptek 2120 PMF Low modulus urethane staking compound
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	Premixed-frozen, low modulus urethane staking compound APTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the staking of electrical/electronic components to printed circuit boards. APTEK 212-PMF is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. APTEK 2120-PMF is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion; superior to silicones. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	0.980 g/cc	0.0354 lb/in³	ASTM D1475
Viscosity	188000 cP	188000 cP	ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	63	63	Cured property; ASTM D2240

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+15 ohm-cm	1.00e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	>= 13.8 kV/mm @Thickness 0.127 mm	>= 350 kV/in @Thickness 0.00500 in	Cured; ASTM D149
Dissipation Factor	0.024 @Frequency 1000 Hz	0.024 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	-60.0 °C	-76.0 °F	Cured property; JMTP P-200
Flash Point	>= 150 °C	>= 302 °F	ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	85.0 °C	185 °F	Cure 5 hrs
	100 °C	212 °F	Cure 3 hrs
	125 °C	257 °F	Cure 1.5 hrs

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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