Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive

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Tra-Con Tra-Bond F175T One-Part Thixotropic UV Curing Adhesive
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	TRA-BOND F175T is a thixotropic, one part UV curing adhesive designed for bonding metals, ceramics and most rigid polymers. It is an excellent adhesive for fiber optic terminations where fast cure with ultraviolet light is desired. It is also recommended for electronic applications as it has very low ionic impurities. TRA-BOND F175T is a unique system which produces very little shrinkage upon cure. It is an excellent choice for high humidity environments or applications requiring thermal cycling. HANDLING: TRA-BOND F175T should be stored with an air space to ensure maximum stability. Do not purge with nitrogen. Information provided by Tra-Con Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.05 g/cc	Mixed

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75

Thermal Properties	Original Value	Comments
CTE, linear	130 µm/m-°C @Temperature 20.0 °C
Maximum Service Temperature, Air	110 °C
Minimum Service Temperature, Air	-55.0 °C
Glass Transition Temp, Tg	11.0 °C	Ultimate Tg

Processing Properties	Original Value	Comments
Cure Time	1.00 sec	400 W/inch @ 1"
	4.00 sec	400 W/inch @ 6"
	45.0 sec	9 mW/inch @ 1"

Descriptive Properties
Color	Light Yellow

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PTRAC243 / 71171

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