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Aptek UVISTAKE 7205LM-PMF UV Curing, Low Outgassing, Urethane staking compound
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: UVISTAKE 7205LM-PMF is a 100% solids, thixotropic, one component, premixed frozen, electrically insulating, urethane system designed for the attachment and staking of electrical/electronic components mounted on printed circuit boards. This system provides an excellent combination of flexibility and strength for demanding applications where toughness is required for the management of thermomechanical stresses. UVISTAKE 7205LM-PMF will become tack free when exposed to the proper UV light radiation. The staking compound will fully post cure in exposed and shaded areas in 14 days at 25ºC and 50% relative humidity, as an alternative, the post cure for the staking compound in both exposed and shaded areas may be accelerated with low to moderate heat.

Multicure mechanism for complete cure in shaded areas underneath components; Good flexibility for reduced stress in the encapsulation of sensitive glass-bodied components; Meets NASA condensable volatile requirements for high vacuum environments; Highly reversion resistant for good physical stability under high heat and humidity environments; Excellent adhesion to plastic/metal components and substrates; More rigid version (95A) available as UVISTAKE 7205-PMF; Packaged in syringes for convenient dispensing; No TDI, no toxic solvents, no free acrylic acid for safety

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.02 g/ccASTM D1475
Outgassing - Total Mass Loss 0.80 - 2.5 %Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.030 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 60Cured property; ASTM D2240
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 5.40e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 1500 V/mil
@Thickness 0.0762 mm
Cured; ASTM D149
 
Thermal PropertiesOriginal ValueComments
CTE, linear 298 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 2; ASTM E831-86
Glass Transition Temp, Tg -35.0 °CCured property; ASTM E831-86
Flash Point >= 100 °CASTM D92

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