Epoxy Technology EPO-TEK® TV2001 Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® TV2001 Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate potlife, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	0.990 g/cc	Part B
	1.45 g/cc	Part A
Particle Size	<= 20 µm
Viscosity	10000 - 20000 cP @Temperature 23.0 °C	20 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	45
Tensile Modulus	16271 psi	Storage
Shear Strength	>= 2000 psi	Lap
	>= 5100 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 8.00e+12 ohm-cm
Dielectric Constant	3.42 @Frequency 1000 Hz
Dissipation Factor	0.016 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	67.0 µm/m-°C	Below Tg
	189 µm/m-°C	Above Tg
Thermal Conductivity	0.400 W/m-K
Maximum Service Temperature, Air	225 °C	Continuous
	325 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 35.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	466 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 160 °C	Minimum
	30.0 min @Temperature 120 °C	Minimum
	60.0 min @Temperature 100 °C	Minimum
	90.0 min @Temperature 80.0 °C	Minimum
Pot Life	2880 min
Shelf Life	12.0 Month @Temperature 25.0 °C
	12.0 Month @Temperature -40.0 °C	PMF Syringe

Descriptive Properties
Color	Golden Yellow	Part B
	White	Part A
Consistency	Smooth paste
Mix Ratio by Weight	100:6
Number of Components	Two
Thixotropic Index	1.95
Weight Loss	0.08%	200°C
	0.17%	250°C
	0.35%	300°C

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PPOXYT103 / 141142

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