Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14. Advantages & Application Notes: Suggested applications: Hybrids: bonding thermo-electric coolers (TEC’s) Power devices: adhesive for low-stress bonding of ferrites; laminating Cu foils to substrates Optics: Die-attaching µ-LCDs to PCB/substrate Flexible potting of kapton flex PCB containing µ-LCD into the frame Adhesive for OEM optics including profilometry Semiconductor: glob top over IC and wire bonds General: adhesive for Al, Cu, Kovar, ceramic, glass, PCBs, and most plastics Rheology allows deposition by hand, dispensers or screen printers. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.08 g/cc	1.08 g/cc	Part B
	1.34 g/cc	1.34 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	30000 - 70000 cP @Temperature 23.0 °C	30000 - 70000 cP @Temperature 73.4 °F	5 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	83	83
Tensile Modulus	0.0179 GPa	2.60 ksi	Storage
Shear Strength	3.96 MPa	574 psi	Lap
	>= 6.56 MPa	>= 952 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+10 ohm-cm	>= 1.00e+10 ohm-cm
Dielectric Constant	6.1 @Frequency 1000 Hz	6.1 @Frequency 1000 Hz
Dissipation Factor	0.146 @Frequency 1000 Hz	0.146 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	48.0 µm/m-°C	26.7 µin/in-°F	Below Tg
	181 µm/m-°C	101 µin/in-°F	Above Tg
Thermal Conductivity	0.500 W/m-K	3.47 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 20.0 °C	>= 68.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	317 °C	603 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	120 min @Temperature 80.0 °C	2.00 hour @Temperature 176 °F	Minimum Bond Line
	2880 min @Temperature 23.0 °C	48.0 hour @Temperature 73.4 °F	Minimum Bond Line
Pot Life	120 min	120 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Clear/Colorless		Part B
	Gray		Part A
Consistency	Smooth paste
Mix Ratio by Weight	10:3
Number of Components	Two
Weight Loss	0.67%		200°C
	1.15%		250°C
	3.14%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT093 / 141132

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