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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Epoxy Technology EPO-TEK® 377 High Temperature Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.

Advantages & Application Notes:

  • Low viscosity epoxy with excellent handling characteristics. It can be used for encapsulating or potting. It may be applied by hand, pouring, spin coating, brushing, dipping, or automated dispensers.
  • Complies with USP Class VI biocompatibility standards.
  • Passes NASA low outgassing standard ASTM E595 with proper cure
  • Suggested Medical Applications / Scientific OEM:
    • Potting fiber ferrules for endoscopes
    • Outstanding high temperature properties at 300°C and excellent solvent, chemical and moisture resistance, including autoclave, ETO, and gamma radiation
  • Suggested Semiconductor Grade epoxy
  • Spin coating at wafer level for MEMS fabrication of pressure sensors and accelerometers
  • Wafer-to-wafer bonding in CSP
  • Capillary underfill of flip chip packaged die
  • Suggested Optical grade epoxy, opto-electronic packaging
  • Transmission in NIR from 700 – 900 nm >95%
  • Glass seal, hermetic seal of glass plates in LCD fabrication
  • Hermetic seal of IR-filter window to aluminum cap of TO-Can in hybrid packaged IR sensors.
  • Suggested Industrial: resist salt water, hydraulic fluids, motor oil, alcohol, 10% nitric acid, 10% sulfuric acid, 10% ammonia solution and most solvents.

    Information Provided by Epoxy Technology

  • Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
     
    Physical PropertiesMetricEnglishComments
    Specific Gravity 1.15 g/cc1.15 g/ccPart A
     1.22 g/cc1.22 g/ccPart B
    Viscosity 150 - 300 cP
    @Temperature 23.0 °C
    150 - 300 cP
    @Temperature 73.4 °F
    100 rpm
     
    Chemical PropertiesMetricEnglishComments
    Ionic Impurities - Na (Sodium) 15 ppm15 ppm
    Ionic Impurities - K (Potassium) 3.0 ppm3.0 ppm
    Ionic Impurities - Cl (Chloride) 26 ppm26 ppm
     
    Mechanical PropertiesMetricEnglishComments
    Hardness, Shore D 6767
    Tensile Modulus 2.58 GPa374 ksiStorage
    Shear Strength 10.04 MPa1456 psiLap
     >= 23.4 MPa>= 3400 psiDie
     
    Electrical PropertiesMetricEnglishComments
    Volume Resistivity >= 1.00e+13 ohm-cm>= 1.00e+13 ohm-cm
    Dielectric Constant 3.36
    @Frequency 1000 Hz
    3.36
    @Frequency 1000 Hz
    Dissipation Factor 0.0050
    @Frequency 1000 Hz
    0.0050
    @Frequency 1000 Hz
     
    Thermal PropertiesMetricEnglishComments
    CTE, linear 57.0 µm/m-°C31.7 µin/in-°FBelow Tg
     210 µm/m-°C117 µin/in-°FAbove Tg
    Maximum Service Temperature, Air 200 °C392 °FContinuous
     300 °C572 °FIntermittent
    Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
     -55.0 °C-67.0 °FIntermittent
    Glass Transition Temp, Tg >= 95.0 °C>= 203 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
    Decomposition Temperature 375 °C707 °FDegradation Temperature
     
    Optical PropertiesMetricEnglishComments
    Refractive Index 1.5195
    @Wavelength 589 nm
    1.5195
    @Wavelength 589 nm
    Transmission, Visible  >= 95 %
    @Wavelength 1000 - 1500 nm
    >= 95 %
    @Wavelength 1000 - 1500 nm
    Spectral
     >= 99 %
    @Wavelength 600 nm
    >= 99 %
    @Wavelength 600 nm
    Spectral
     
    Processing PropertiesMetricEnglishComments
    Cure Time 60.0 min
    @Temperature 150 °C
    1.00 hour
    @Temperature 302 °F
    Minimum Bond Line
    Pot Life 1440 min1440 min
    Shelf Life 12.0 Month
    @Temperature 25.0 °C
    12.0 Month
    @Temperature 77.0 °F
     
    Compliance PropertiesMetricEnglishComments
    USP Class VI YesYes
     
    Descriptive Properties
    ColorAmberPart B
     Clear/ColorlessPart A
    ConsistencyPourable liquid
    Ionic Impurities NH422 ppm
    Mix Ratio by Weight1:1
    Number of ComponentsTwo
    Weight Loss0.06%200°C
     0.17%250°C
     0.5%300°C

    Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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    PPOXYT132 / 141171

    USP Class VI Adhesives
    USP Class VI Approved Adhesives for Medical Device Applications
    Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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