Epoxy Technology EPO-TEK® H31D-LV Epoxy

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Epoxy Technology EPO-TEK® H31D-LV Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It is a NASA approved low outgassing epoxy. It is a lower viscosity version of EPO-TEK® H31D. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.13 g/cc	2.13 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	10000 - 15000 cP @Temperature 23.0 °C	10000 - 15000 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	145 ppm	145 ppm
Ionic Impurities - K (Potassium)	33 ppm	33 ppm
Ionic Impurities - Cl (Chloride)	17 ppm	17 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85
Tensile Modulus	2.14 GPa	310 ksi	Storage
Shear Strength	9.31 MPa	1350 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0080 ohm-cm	<= 0.0080 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Below Tg
	143 µm/m-°C	79.4 µin/in-°F	Above Tg
Thermal Conductivity	0.890 W/m-K	6.18 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature	456 °C	853 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	Minimum
Pot Life	40320 min	40320 min
Shelf Life	6.00 Month	6.00 Month	refrigerated

Descriptive Properties
Color	Silver
Consistency	Smooth paste
Number of Components	Single
Thixotropic Index	1.6
Weight Loss	<0.5%		200°C
	0.08%		300°C

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PPOXYT043 / 141082

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