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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® EE149-6 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.27 g/cc3.27 g/cc
Particle Size <= 20 µm<= 20 µm
Viscosity 2000 - 4000 cP
@Temperature 23.0 °C
2000 - 4000 cP
@Temperature 73.4 °F
100 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 8.0 ppm8.0 ppm
Ionic Impurities - K (Potassium) 5.0 ppm5.0 ppm
Ionic Impurities - Cl (Chloride) 4.0 ppm4.0 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7474
Tensile Modulus 3.77 GPa547 ksiStorage
Shear Strength 3.78 MPa548 psiLap
 >= 35.2 MPa>= 5100 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.00050 ohm-cm<= 0.00050 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 34.0 µm/m-°C18.9 µin/in-°FBelow Tg
 113 µm/m-°C62.8 µin/in-°FAbove Tg
Thermal Conductivity 0.980 W/m-K6.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °FContinuous
 300 °C572 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 130 °C>= 266 °FDynamic Cure 20—300°C /ISO 25 Min; Ramp -10—300°C @ 20°C/Min
Decomposition Temperature 380 °C716 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time 10.0 min
@Temperature 70.0 °C
0.167 hour
@Temperature 158 °F
Pot Life 36000 min36000 min
Shelf Life 6.00 Month
@Temperature -40.0 °C
6.00 Month
@Temperature -40.0 °F
 
Descriptive Properties
ColorSilver
ConsistencySmooth paste
Ionic Impurities NH410 ppm
Number of ComponentsSingle
Thixotropic Index4.7
Weight Loss0.05%250°C
 0.16%300°C

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PPOXYT018 / 141056

Chemically Resistant adhesives

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