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Epoxy Technology EPO-TEK® EE149-6 Epoxy
Categories:
Polymer
;
Thermoset
;
Epoxy
Material Notes:
Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.
Information Provided by Epoxy Technology
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Physical Properties
Original Value
Comments
Specific Gravity
3.27
g/cc
Particle Size
<=
20
µm
Viscosity
2000
-
4000
cP
@Temperature 23.0 °C
100 rpm
Chemical Properties
Original Value
Comments
Ionic Impurities - Na (Sodium)
8.0
ppm
Ionic Impurities - K (Potassium)
5.0
ppm
Ionic Impurities - Cl (Chloride)
4.0
ppm
Mechanical Properties
Original Value
Comments
Hardness, Shore D
74
Tensile Modulus
547000
psi
Storage
Shear Strength
548
psi
Lap
>=
5100
psi
Die
Electrical Properties
Original Value
Comments
Volume Resistivity
<=
0.00050
ohm-cm
Thermal Properties
Original Value
Comments
CTE, linear
34.0
µm/m-°C
Below Tg
113
µm/m-°C
Above Tg
Thermal Conductivity
0.980
W/m-K
Maximum Service Temperature, Air
200
°C
Continuous
300
°C
Intermittent
Minimum Service Temperature, Air
-55.0
°C
Continuous
-55.0
°C
Intermittent
Glass Transition Temp, Tg
>=
130
°C
Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—300°C @ 20°C/Min
Decomposition Temperature
380
°C
Degradation Temperature
Processing Properties
Original Value
Comments
Cure Time
10.0
min
@Temperature 70.0 °C
Pot Life
36000
min
Shelf Life
6.00
Month
@Temperature -40.0 °C
Descriptive Properties
Color
Silver
Consistency
Smooth paste
Ionic Impurities NH
4
10 ppm
Number of Components
Single
Thixotropic Index
4.7
Weight Loss
0.05%
250°C
0.16%
300°C
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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PPOXYT018 / 141056
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