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Chemically Resistant adhesives

Rogers Corporation RO4533 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate
Categories: Polymer; Thermoset

Material Notes: The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

Features:

  • Loss range (0.0020 to 0.0037)
  • Dk range (3.3 to 3.5)
  • Low PIM response
  • Thermoset resin system
  • Excellent dimensional stability
  • Uniform mechanical properties
  • High thermal conductivity
  • Lead-free process compatible

Benefits:

  • Wide range of application use, including Cellular infrastructure base station antennas and WiMAX antenna networks
  • Compatible with standard PCB fabrication
  • Greater yield on larger panel sizes
  • Robust handling and long life in use with thin materials
  • Improved power handling

Information provided by Rogers Corporation.

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Physical PropertiesMetricEnglishComments
Density 1.80 g/cc0.0650 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.020 %0.020 %D48/50; IPC-TM-650 2.6.2.1; ASTM D570
 
Mechanical PropertiesMetricEnglishComments
Peel Strength 1.23 kN/m7.00 pliCopper; 1 oz. EDC post Solder Float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.22 - 3.38
@Frequency 1e+10 Hz
3.22 - 3.38
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dielectric Strength >= 19.7 kV/mm
@Thickness 0.510 mm
>= 500 kV/in
@Thickness 0.0201 in
Z Direction; IPC-TM-650 2.5.6.2
Dissipation Factor  0.0020
@Frequency 2.50e+9 Hz
0.0020
@Frequency 2.50e+9 Hz
Z direction; IPC-TM-650 2.5.5.5
 0.0025
@Frequency 1e+10 Hz
0.0025
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  11.0 µm/m-°C
@Temperature -55.0 - 288 °C
6.11 µin/in-°F
@Temperature -67.0 - 550 °F
Y-Direction; ASTM D3386-94
 13.0 µm/m-°C
@Temperature -55.0 - 288 °C
7.22 µin/in-°F
@Temperature -67.0 - 550 °F
X-Direction; ASTM D3386-94
 37.0 µm/m-°C
@Temperature -55.0 - 288 °C
20.6 µin/in-°F
@Temperature -67.0 - 550 °F
Z-Direction; ASTM D3386-94
Thermal Conductivity 0.600 W/m-K
@Temperature 80.0 °C
4.16 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Glass Transition Temp, Tg >= 280 °C>= 536 °FTGA, Condition A; IPC-TM-650 2.4.24
 
Descriptive Properties
Dimensional Stability< 0.2 mm/mX, Y directions; after etch; IPC-TM-650, 2.4.39A
PIM150 - 160 DbcSummitek 1900b PIM analyzer; Reflected 43 dBm swept tones

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PROGA958 / 138398

Chemically Resistant adhesives

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