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Chemically Resistant adhesives

Rogers Corporation RO4450B Prepreg
Categories: Polymer; Thermoset
Material Notes: Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycle.

Information provided by Rogers Corporation.
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Physical PropertiesMetricEnglishComments
Density 1.80 g/cc0.0650 lb/in³3.6 mil thickness; ASTM D792
 1.86 g/cc0.0672 lb/in³4.0 mil thickness; ASTM D792
Moisture Absorption at Equilibrium  0.010 %
@Temperature 50.0 °C,
Time 173000 sec		0.010 %
@Temperature 122 °F,
Time 48.0 hour		Immersion, for 3.6 mil thickness grade; ASTM D570
 0.050 %
@Temperature 50.0 °C,
Time 173000 sec		0.050 %
@Temperature 122 °F,
Time 48.0 hour		Immersion, for 4.0 mil thickness grade; ASTM D570
Thickness 91.4 - 102 microns3.60 - 4.00 milRange of Thicknesses available
 
Mechanical PropertiesMetricEnglishComments
Peel Strength 0.701 kN/m4.00 pliCopper adhesion; 3.6 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8
 0.859 kN/m4.90 pliCopper adhesion; 4.0 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 9.26e+13 ohm-cm9.26e+13 ohm-cm50% RH; IPC 2.5.17.1
Dielectric Constant  3.25 - 3.35
@Frequency 1e+10 Hz		3.25 - 3.35
@Frequency 1e+10 Hz		3.6 mil thickness, Z direction; IPC-TM-650 2.5.5.5
 3.49 - 3.59
@Frequency 1e+10 Hz		3.49 - 3.59
@Frequency 1e+10 Hz		4.0 mil thickness, Z direction; IPC-TM-650 2.5.5.6
Dielectric Strength 39.4 kV/mm1000 kV/inZ Direction, 50% RH; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0040
@Frequency 1e+10 Hz		0.0040
@Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  17.0 µm/m-°C
@Temperature -55.0 - 280 °C		9.44 µin/in-°F
@Temperature -67.0 - 536 °F		Y Direction; IPC-TM-650 2.4.41
 19.0 µm/m-°C
@Temperature -55.0 - 280 °C		10.6 µin/in-°F
@Temperature -67.0 - 536 °F		X Direction; IPC-TM-650 2.4.41
 50.0 µm/m-°C
@Temperature -55.0 - 280 °C		27.8 µin/in-°F
@Temperature -67.0 - 536 °F		Z Direction, 4.0 mil thickness; IPC-TM-650 2.4.41
 60.0 µm/m-°C
@Temperature -55.0 - 280 °C		33.3 µin/in-°F
@Temperature -67.0 - 536 °F		Z Direction, 3.6 mil thickness; IPC-TM-650 2.4.41
Thermal Conductivity 0.600 W/m-K
@Temperature 80.0 °C		4.16 BTU-in/hr-ft²-°F
@Temperature 176 °F		Z Direction; ASTM C518
Glass Transition Temp, Tg >= 280 °C>= 536 °F10°C/min, TGA; IPC-TM-650 2.4.24
Decomposition Temperature 390 °C734 °FTGA; ASTM D3850
Flammability, UL94 V-0V-0

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PROGA956 / 138396

Chemically Resistant adhesives




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