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Chemically Resistant adhesives

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Rogers Corporation RO4450B Prepreg
Categories: Polymer; Thermoset

Material Notes: Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycle.

Information provided by Rogers Corporation.

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Physical PropertiesOriginal ValueComments
Density 1.80 g/cc3.6 mil thickness; ASTM D792
 1.86 g/cc4.0 mil thickness; ASTM D792
Moisture Absorption at Equilibrium 0.010 %
@Temperature 50.0 °C,
Time 173000 sec
Immersion, for 3.6 mil thickness grade; ASTM D570
 0.050 %
@Temperature 50.0 °C,
Time 173000 sec
Immersion, for 4.0 mil thickness grade; ASTM D570
Thickness 3.60 - 4.00 milRange of Thicknesses available
 
Mechanical PropertiesOriginal ValueComments
Peel Strength 4.00 pliCopper adhesion; 3.6 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8
 4.90 pliCopper adhesion; 4.0 mil thickness; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 9.26e+13 ohm-cm50% RH; IPC 2.5.17.1
Dielectric Constant 3.25 - 3.35
@Frequency 1e+10 Hz
3.6 mil thickness, Z direction; IPC-TM-650 2.5.5.5
 3.49 - 3.59
@Frequency 1e+10 Hz
4.0 mil thickness, Z direction; IPC-TM-650 2.5.5.6
Dielectric Strength 1000 V/milZ Direction, 50% RH; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0040
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature -55.0 - 280 °C
Y Direction; IPC-TM-650 2.4.41
 19.0 µm/m-°C
@Temperature -55.0 - 280 °C
X Direction; IPC-TM-650 2.4.41
 50.0 µm/m-°C
@Temperature -55.0 - 280 °C
Z Direction, 4.0 mil thickness; IPC-TM-650 2.4.41
 60.0 µm/m-°C
@Temperature -55.0 - 280 °C
Z Direction, 3.6 mil thickness; IPC-TM-650 2.4.41
Thermal Conductivity 0.600 W/m-K
@Temperature 80.0 °C
Z Direction; ASTM C518
Glass Transition Temp, Tg >= 280 °C10°C/min, TGA; IPC-TM-650 2.4.24
Decomposition Temperature 390 °CTGA; ASTM D3850
Flammability, UL94 V-0

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PROGA956 / 138396

Chemically Resistant adhesives

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