MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
Chemically Resistant adhesives
Epoxy Technology EPO-TEK® T7109 Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Product Description: EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries.

Advantages & Application Notes:

  • Reliability report available describing its performance
    • Thermal resistance compared to three other epoxies
    • Thermal resistance and how it relates to overall thermal conductivity
    • Strength measurements plotted versus pot-life, versus Tcycles and damp heat (85°C/85%RH).
  • Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
  • Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.
  • Suggested Applications:
    • Semiconductor - Thermally conductive underfill / Electrically non conductive die-attach, low stress for large die exceeding 500 mil x 500 mil.
    • Hybrid Micro-electronics - Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing
    • Fiber Optic Packaging - Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
    • Liquid Crystal Displays - die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.
    • Medical - Heat sinking electronics found in ultrasound and CT Detectors, and other radiation devices.
  • Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices.
  • Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.

Information Provided by Epoxy Technology

Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Particle Size
  • Viscosity, 20 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
), please click the button below.

Manufacturer Notes:

Category Notes

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.


Chemically Resistant adhesives
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.