| Product Description: EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries. Advantages & Application Notes: - Reliability report available describing its performance
- Thermal resistance compared to three other epoxies
- Thermal resistance and how it relates to overall thermal conductivity
- Strength measurements plotted versus pot-life, versus Tcycles and damp heat (85°C/85%RH).
- Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
- Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.
- Suggested Applications:
- Semiconductor - Thermally conductive underfill / Electrically non conductive die-attach, low stress for large die exceeding 500 mil x 500 mil.
- Hybrid Micro-electronics - Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing
- Fiber Optic Packaging - Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
- Liquid Crystal Displays - die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.
- Medical - Heat sinking electronics found in ultrasound and CT Detectors, and other radiation devices.
- Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices.
- Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.
Information Provided by Epoxy Technology |
