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Rulon Bearings
Brewer Science WaferBOND HT-10.10 Temporary Bonding Material
Categories: Other Engineering Material

Material Notes: WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment.


  • Process ultrathin wafers in temperatures up to 220°C
  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer
  • Debonding with the WaferBOND® HT System
  • The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

    Information provided by Brewer Science.

Available Properties
  • Viscosity, Melt Viscosity
  • Viscosity, Melt Viscosity
  • Viscosity, Melt Viscosity
  • Brookfield Viscosity
  • Brookfield Viscosity
  • Thickness, Spin Speed 2400 rpm
  • Thickness, Spin Speed 1400 rpm
  • Thickness, Spin Speed 400 rpm
  • Storage Temperature
Property Data

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Master Bond adhesives
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