MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Ensinger PEI

(Viewing data as-entered. Click here to return)
Brewer Science WaferBOND HT-10.10 Temporary Bonding Material
Categories: Other Engineering Material

Material Notes: WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment.

Capabilities:

  • Process ultrathin wafers in temperatures up to 220°C
  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer
  • Debonding with the WaferBOND® HT System
  • The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

    Information provided by Brewer Science.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Viscosity 100000 cP
@Temperature 250 °C
Melt Viscosity
 1.00e+6 cP
@Temperature 150 °C
Melt Viscosity
 1.40e+10 cP
@Temperature 50.0 °C
Melt Viscosity
Brookfield Viscosity 1020 cP
@Temperature 37.8 °C
 1840 cP
@Temperature 25.0 °C
Thickness 10.0 micronsSpin Speed 2400 rpm
 16.0 micronsSpin Speed 1400 rpm
 56.0 micronsSpin Speed 400 rpm
Storage Temperature 16.0 - 26.0 °C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Brewer Science ProTEK® PSB Photosensitive Protective Coating
Brewer Science BrewerBOND® 701 Laser Release Material
Brewer Science WaferBOND CR-220 Temporary Bonding Material
Brewer Science BrewerBOND® 510 Temporary Bonding Material
Brewer Science BrewerBOND® 305 Temporary Bonding Material

PBREW997 / 193513

Proto3000 – 3D Engineering Solutions

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.