Brewer Science WaferBOND HT-10.10 Temporary Bonding Material

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Brewer Science WaferBOND HT-10.10 Temporary Bonding Material
Categories:	Other Engineering Material
Material Notes:	WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment. Capabilities: Process ultrathin wafers in temperatures up to 220°C Protect the wafer edge from chipping Protect circuitry from harsh chemical etchants Provide a void-free interface for a smooth surface on the final thinned wafer Debonding with the WaferBOND® HT System The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer. Information provided by Brewer Science.
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Physical Properties	Metric	English	Comments

Viscosity	100000 cP @Temperature 250 °C	100000 cP @Temperature 482 °F	Melt Viscosity
	1.00e+6 cP @Temperature 150 °C	1.00e+6 cP @Temperature 302 °F	Melt Viscosity
	1.40e+10 cP @Temperature 50.0 °C	1.40e+10 cP @Temperature 122 °F	Melt Viscosity
Brookfield Viscosity	1020 cP @Temperature 37.8 °C	1020 cP @Temperature 100 °F
	1840 cP @Temperature 25.0 °C	1840 cP @Temperature 77.0 °F
Thickness	10.0 microns	0.394 mil	Spin Speed 2400 rpm
	16.0 microns	0.630 mil	Spin Speed 1400 rpm
	56.0 microns	2.20 mil	Spin Speed 400 rpm
Storage Temperature	16.0 - 26.0 °C	60.8 - 78.8 °F

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PBREW997 / 193513

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