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Chemically Resistant adhesives
Cookson Group Plaskon® 1031 Conventional Encapsulant  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability

Vendors:
Available Properties
  • Density
  • Viscosity, Automatic orifice Viscosity
  • Spiral Flow, 177°C/1000 psi
  • Hardness, Shore D
  • Flexural Strength
  • Flexural Modulus
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear
  • CTE, linear, Transverse to Flow
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Flammability, UL94
  • Processing Temperature, Molding temperature
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Chemically Resistant adhesives
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