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Chemically Resistant adhesives

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Cookson Group Plaskon® 1031 Conventional Encapsulant  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability

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Physical PropertiesOriginal ValueComments
Density 1.98 g/cc
Viscosity 13500 cP
@Temperature 175 °C
Automatic orifice Viscosity
Spiral Flow 69.0 - 93.0 cm177°C/1000 psi
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 79
Flexural Strength 131 MPa
Flexural Modulus 18.0 GPa
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
Dissipation Factor 0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 µm/m-°C
@Temperature 20.0 °C
CTE, linear, Transverse to Flow 62.0 µm/m-°C
@Temperature 20.0 °C
Thermal Conductivity 0.800 W/m-K
Glass Transition Temp, Tg 155 °C
Flammability, UL94 V-0
@Thickness 1.60 mm
 V-0
@Thickness 1.60 mm
 
Processing PropertiesOriginal ValueComments
Processing Temperature 170 - 185 °CMolding temperature

**
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PCOOK304 / 21400

Chemically Resistant adhesives

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