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Elmet Technologies
Sika AcouBond®-System Elastic Bonding and Acoustical Dampening
Categories: Other Engineering Material

Material Notes: The Sika AcouBond-System incorporates Direct Bond Technology with acoustic performance. The Sika AcouBond-System consists of SikaLayer-03, a 1/8” (3 mm) proprietary specially slotted foam mat, and the SikaBond-T53, unique permanently elastic, super strong, sound dampening adhesive that form a tenacious bond to wood flooring, plywood subfloors, concrete and other common subfloor materials

Uses: The Sika AcouBond-System is used to bond structurally sound solid and engineered hardwood in new construction and renovations in residential, office, and industrial buildings as well as sales and show rooms. It is commonly used over in-floor radiant heating and on grade cement and gypsum-based slabs. Field testing demonstrates unmatched sound reductions.

Advantages:

  • Independently tested to – FIIC 59 and FSTC 59
  • Extremely easy to install
  • Structurally bonds wood flooring to subfloor
  • SikaBond-T53 bonds solid wood flooring up to 8 in. (18 cm) wide and engineered planks up to 14 in. (36 cm) wide directly to concrete substrates. No limitations on maximum wood length.
  • Eliminates the extensive labor of installing cork underlayments
  • No need for sleepers and plywood over concrete- and gypsum-based subfloors
  • Innovative walk-on work method
  • Can reduce overall installation costs up to 30%
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress on the substrate

Information provided by Sika Corporation.

Vendors:
Available Properties
  • Density, with SikaLayer-03
  • Volatile Organic Compounds (VOC) Content, with SikaBond-T53
  • Thickness, with SikaLayer-03
  • Storage Temperature, with SikaLayer-03
  • Storage Temperature, with SikaBond-T53
  • Hardness, Shore A, 28 days at 73°F(23°C) and 50% RH, with SikaBond-T53
  • Tensile Strength, cured at 73°F(23°C) and 50% RH, with SikaBond-T53
  • Elongation at Break, cured at 73°F(23°C) and 50% RH, with SikaBond-T53
  • Shear Strength, 1 mm adhesive thickness at 73°F(23°C) and 50% RH, with SikaBond-T53
  • Thermal Conductivity, with SikaLayer-03
  • Maximum Service Temperature, Air, suitable for in-floor radiant heating, with SikaBond-T53
  • Minimum Service Temperature, Air, suitable for in-floor radiant heating, with SikaBond-T53
  • Cure Time, 50% RH, with SikaBond-T53
  • Tack-Free Time, 50% RH, with SikaBond-T53
  
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