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Ensinger PEI

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Sika AcouBond®-System Elastic Bonding and Acoustical Dampening
Categories: Other Engineering Material

Material Notes: The Sika AcouBond-System incorporates Direct Bond Technology with acoustic performance. The Sika AcouBond-System consists of SikaLayer-03, a 1/8” (3 mm) proprietary specially slotted foam mat, and the SikaBond-T53, unique permanently elastic, super strong, sound dampening adhesive that form a tenacious bond to wood flooring, plywood subfloors, concrete and other common subfloor materials

Uses: The Sika AcouBond-System is used to bond structurally sound solid and engineered hardwood in new construction and renovations in residential, office, and industrial buildings as well as sales and show rooms. It is commonly used over in-floor radiant heating and on grade cement and gypsum-based slabs. Field testing demonstrates unmatched sound reductions.

Advantages:

  • Independently tested to – FIIC 59 and FSTC 59
  • Extremely easy to install
  • Structurally bonds wood flooring to subfloor
  • SikaBond-T53 bonds solid wood flooring up to 8 in. (18 cm) wide and engineered planks up to 14 in. (36 cm) wide directly to concrete substrates. No limitations on maximum wood length.
  • Eliminates the extensive labor of installing cork underlayments
  • No need for sleepers and plywood over concrete- and gypsum-based subfloors
  • Innovative walk-on work method
  • Can reduce overall installation costs up to 30%
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress on the substrate

Information provided by Sika Corporation.

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Physical PropertiesOriginal ValueComments
Density 1.87 g/ccwith SikaLayer-03
Volatile Organic Compounds (VOC) Content 48.3 g/lwith SikaBond-T53
Thickness 3000 micronswith SikaLayer-03
Storage Temperature 10.0 - 25.0 °Cwith SikaLayer-03
 10.0 - 25.0 °Cwith SikaBond-T53
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 4028 days at 73°F(23°C) and 50% RH, with SikaBond-T53
Tensile Strength 174 psicured at 73°F(23°C) and 50% RH, with SikaBond-T53
Elongation at Break 500 %cured at 73°F(23°C) and 50% RH, with SikaBond-T53
Shear Strength 174 psi1 mm adhesive thickness at 73°F(23°C) and 50% RH, with SikaBond-T53
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 0.0420 W/m-Kwith SikaLayer-03
Maximum Service Temperature, Air 158 °Fsuitable for in-floor radiant heating, with SikaBond-T53
Minimum Service Temperature, Air -40.0 °Fsuitable for in-floor radiant heating, with SikaBond-T53
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Thickness 3000 mm
50% RH, with SikaBond-T53
Tack-Free Time 45.0 - 60.0 min50% RH, with SikaBond-T53
 
Descriptive Properties
Chemical BasePolyethylene foamwith SikaLayer-03
ColorGraywith SikaLayer-03
 Whitewith SikaBond-T53
Footfall Sound Reduction<24 dBwith SikaLayer-03

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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