UV-MX 2231 is a low viscosity, Photo/thermal curing, bonding/encapsulant for micro-electronic applications. This two-part hybrid UV-epoxy based polymer is designed to bond difficult substrates by gelling to a tack free, non-flow state after brief exposure to moderate UV light followed by thermal cure. After UV exposure, the product can withstand mild handling and defixturing. A secondary room temperature or heat cure is needed to complete the polymerization process yielding a product with excellent dimensional stability, low outgassing, and outstanding bond strength. This product’s ability to “dark-cure” via conventional amine cross-linking makes it ideal for those applications that require the on-line speed of a UV cure and the versatility of a two-part epoxy cure.

Applications:

Disk drive-engineering products, voice coil to armatures. Bearing cartridge. Spindle motor. Magnet assembly. Screw tamper proofing. Electronicopto: back-filling connectors, stress relief bridge bonds, mounting transducers.

Processing:

UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers.

Information provided by Resin Technology Group.