These thermoplastic adhesive pastes are designed for use in a variety of electronic applications. These materials are ideal for applications where resistance to high temperature excursions is desired. These paste adhesives can be used for die attaching solder sealed, hermetic packages and have demonstrated low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features: - Fully polymerized resin - No "cure"
- Easily reworkable - No outgassing
- Bonds in seconds - Not hours or minutes
- Low modulus reduces stress to bonded materials
Information provided by Cookson Electronics |