Aptek 6500-PMF Electrically conductive epoxy adhesive

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Aptek 6500-PMF Electrically conductive epoxy adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Electrically Conductive
Material Notes:	High purity, low outgassing, electrically conductive adhesive APTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications High purity resin system for minimum level of ionic contamination to prevent corrosion problems; High cross-link density to maintain stability and minimize outgassing during operational life even in high-vacuum environments and sealed packages; Smooth thixotropic consistency for machine stamping applications; Viscosity can be factory controlled for screening or dispensing applications; Contains no diluents or solvents to minimize formation of voids during cure Information provided by Aptek Laboratories, Inc.
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Physical Properties	Original Value	Comments

Density	2.90 g/cc	ASTM D1475
Viscosity	25000 cP	Spindle #5; 10 rpm; ASTM D1824
Outgassing - Total Mass Loss	0.10 %	Cured property at 125ºC; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.0010 %	Cured property at 125ºC; at 10E-6 torr; ASTM E595

Mechanical Properties	Original Value	Comments
Hardness, Shore D	89	ASTM D2240
Adhesive Bond Strength	2200 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002
	5700 psi	Cured property; Die Shear for Ag to Si, 0.07" x 0.07" IC

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00020 ohm-cm	Cured property; ASTM D257

Thermal Properties	Original Value	Comments
CTE, linear	45.0 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 1; Perkin Elmer TMS-2
	147 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg	155 °C	Cured property; Perkin-Elmer TMS-2
Flash Point	>= 150 °C	ASTM D92

Processing Properties	Original Value	Comments
Processing Temperature	150 °C	Cure 2 hrs
	165 °C	Cure 2 hrs

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PAPTEK16 / 24178

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