Henkel Loctite® ABLESTIK QMI529HT-LV Adhesive

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Henkel Loctite® ABLESTIK QMI529HT-LV Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Gray Filler Type: Silver Cure: Heat cure Product Benefits: Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic Stable at high temperatures Low moisture absorption Excellent adhesion Low stress Thermally stable at 260ºC reflow Passes NASA outgassing Passes MIL STD 883, Method 5011 Application: Die attach LOCTITE ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. LOCTITE ABLESTIK QMI529HT-LV passes NASA outgassing standards. LOCTITE ABLESTIK QMI529HT-LV passes MIL-STD-883 standards, Method 5011. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	16000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	738 MPa @Temperature 250 °C	Cured, DMTA
	817 MPa @Temperature 200 °C	Cured, DMTA
	1010 MPa @Temperature 150 °C	Cured, DMTA
	4910 MPa @Temperature 25.0 °C	Cured, DMTA
	9700 MPa @Temperature -65.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.000050 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	62.0 µm/m-°C	Cured, Below Tg
	162 µm/m-°C	Cured, Above Tg
Thermal Conductivity	8.00 W/m-K	Cured

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175°C + 1 hour @ 175°C

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<10	Cured, Fluoride (F-)
Shear Strength	2.71 kg-f	Die, 3 x 3 mm Die on Ag Leadframe, Post Cure + PMB + Moisture @ 200°C
	20 kg-f	Die, 3 x 3 mm Die on Ag Leadframe, Post Cure @ 25°C
	3.75 kg-f	Die, 3 x 3 mm Die on Ag Leadframe, Post Cure @ 260°C
	4.79 kg-f	Die, 3 x 3 mm Die on Ag Leadframe, Post Cure + PMB
Thixotropic Index	4	Uncured, 0.5/5 rpm

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PLOCT5062 / 255273

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