Henkel Loctite® ABLESTIK QMI529HT-LV Adhesive

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Henkel Loctite® ABLESTIK QMI529HT-LV Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Gray Filler Type: Silver Cure: Heat cure Product Benefits: Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic Stable at high temperatures Low moisture absorption Excellent adhesion Low stress Thermally stable at 260ºC reflow Passes NASA outgassing Passes MIL STD 883, Method 5011 Application: Die attach LOCTITE ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. LOCTITE ABLESTIK QMI529HT-LV passes NASA outgassing standards. LOCTITE ABLESTIK QMI529HT-LV passes MIL-STD-883 standards, Method 5011. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Brookfield Viscosity	16000 cP	16000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.738 GPa @Temperature 250 °C	107 ksi @Temperature 482 °F	Cured, DMTA
	0.817 GPa @Temperature 200 °C	118 ksi @Temperature 392 °F	Cured, DMTA
	1.01 GPa @Temperature 150 °C	146 ksi @Temperature 302 °F	Cured, DMTA
	4.91 GPa @Temperature 25.0 °C	712 ksi @Temperature 77.0 °F	Cured, DMTA
	9.70 GPa @Temperature -65.0 °C	1410 ksi @Temperature -85.0 °F	Cured, DMTA

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.000050 ohm-cm	0.000050 ohm-cm	Cured

Thermal Properties	Metric	English	Comments
CTE, linear	62.0 µm/m-°C	34.4 µin/in-°F	Cured, Below Tg
	162 µm/m-°C	90.0 µin/in-°F	Cured, Above Tg
Thermal Conductivity	8.00 W/m-K	55.5 BTU-in/hr-ft²-°F	Cured

Processing Properties	Metric	English	Comments
Cure Time	30.0 min	0.500 hour	ramp to 175°C + 1 hour @ 175°C

Descriptive Properties
Extractable Ionic Content (ppm)	<10		Cured, Chloride (Cl-)
	<10		Cured, Sodium (Na+)
	<10		Cured, Potassium (K+)
	<10		Cured, Fluoride (F-)
Shear Strength	2.71 kg-f		Die, 3 x 3 mm Die on Ag Leadframe, Post Cure + PMB + Moisture @ 200°C
	20 kg-f		Die, 3 x 3 mm Die on Ag Leadframe, Post Cure @ 25°C
	3.75 kg-f		Die, 3 x 3 mm Die on Ag Leadframe, Post Cure @ 260°C
	4.79 kg-f		Die, 3 x 3 mm Die on Ag Leadframe, Post Cure + PMB
Thixotropic Index	4		Uncured, 0.5/5 rpm

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PLOCT5062 / 255273

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