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Ensinger PEI

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Aptek 6109-A/B Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices

Part A is blue. Part B is clear to pale yellow.

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.15 g/ccA Component; ASTM D1475
 1.20 g/ccB Component; ASTM D1475
Viscosity 350 cPB Component; Spindle #2; speed 50 rpm; ASTM D1824
 20000 cPA Component; Spindle #5; speed 10 rpm; ASTM D1824
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 82Cured property; ASTM D2240
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 3.8
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.015
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 99.0 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 1; Perkin Elmer TMS-2
 225 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg 84.0 °CCured property; Perkin Elmer TMS-2
Flash Point >= 150 °CB Component; ASTM D92
 >= 200 °CA Component; ASTM D92
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.48B Component
 1.538Mixed Liquid
 1.57A Component
 
Processing PropertiesOriginal ValueComments
Processing Temperature 115 °CCure 8 hrs.

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