| Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach. Advantages & Application Notes: - Flexible alternative to EPO-TEK® H20E, designed to offer lower stress, less cracking, and more flexibility.
- Rheology provides a very soft, smooth, thixotropic paste. No solvents are present.
- A film suitable for Kapton or Mylar can be flexed 180 degrees and creased without de-lamination or loss of conductivity; can be used instead of conductive silicone RTVs.
- Can be applied by screen printing, stamping, roller coating techniques; or hand applied.
- Recommended for fiber-optic packaging. Also suggested for bonding SAW devices, as a low stress adhesive.
- Applications or end-use could be speaker or microphone circuit related.
- Hybrid level die attach epoxy capable of resisting wire bonding operations. Also, lid sealing operations will not affect bonded chips in the package.
- Suggested as a low stress conductive adhesive for large die sizes, as well as oversized components or substrates.
Information Provided by Epoxy Technology |
