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Ensinger PEI

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Applied Nanotech Cu-iJ70P Copper Ink
Categories: Other Engineering Material; Ceramic/Metallic Coating

Material Notes: ANI’s copper pastes can be used to create high conductivity patterns for applications in the printed electronics industry. ANI’s Cu-iJ70P paste is printed and thermally sintered to form conductive patterns on substrates such as glass, ceramics, and Kapton®. Cu-iJ70P has a high solid content with the small particle size enabling the printing of thick lines and patterns with rapid low energy curing.

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Physical PropertiesOriginal ValueComments
Solids Content 60 %
Particle Size 0.070 µm
Viscosity 30000 - 40000 cP
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.0000070 - 0.000060 ohm-cm
 
Descriptive Properties
Conductive Filler TypeCopper (Cu)
Material TypeReady-To-Use Formulation
Recommended Substratesglass, ceramics, and Kapton®
Solvent SystemOrganic

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