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Ensinger PEI

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Henkel Loctite® ECCOBOND FP4451TD Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • High purity
  • Excellent chemical resistance
  • Exceptional thermal stability
Application: Encapsulant - dam

Filler Type Silica

Typical Package Application: BGA and IC memory cards

LOCTITE ECCOBOND FP4451TD damming material is designed as a flow control barrier around areas of bare chip encapsulation.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.79 g/cc
Filler Content 73 %
Particle Size 20 µmmedian
 <= 200 µmmaximum
Brookfield Viscosity 300000 cPSpindle 7, speed 20 rpm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 21.0 µm/m-°C
@Temperature 40.0 - 120 °C
Cured, Below Tg
 65.0 µm/m-°C
@Temperature 190 - 220 °C
Cured, Above Tg
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -65.0 °C
Glass Transition Temp, Tg 150 °CCured, by TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 125 °C
plus 90 minutes @ 165°C
Gel Time 13.0 min
@Temperature 121 °C
 
Descriptive Properties
Extractable Ionic Content (ppm)<1Cured, Sodium (Na+)
 <1Cured, Potassium (K+)
 <10Cured, Chloride (Cl-)
Pot Life10 daystime to double viscosity

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PLOCT5079 / 255290

Proto3000 – 3D Engineering Solutions

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