Solvay DAPCO™ 3004 Rapid Cure Epoxy Adhesive & Repair Compound

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Solvay DAPCO™ 3004 Rapid Cure Epoxy Adhesive & Repair Compound
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Description: DAPCO™ 3004 is a two-component, high strength, structural epoxy adhesive which cures at normal room temperature. Features & Benefits: Thixotropic flow properties permit use on vertical or overhead areas Bonds a variety of substrates, including metal, wood, concrete and plastic High resistance to cold and hot water, acids, alkalis, solvents, oils, grease, etc. Applications: DAPCO 3004 is most commonly used as an insert potting compound as well as a general purpose adhesive. The product can be applied by extrusion, trowel, etc. Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Original Value	Comments

Density	1.28 g/cc	Part A
	1.32 g/cc	Mixed
	1.38 g/cc	Part B
Solids Content	95 %	Part B
	98 %	Mixed
	100 %	Part A

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85 - 95
Tensile Strength	3000 psi
Elongation at Break	3.0 %
Adhesive Bond Strength	1200 psi	Shear, Concrete/Concrete substrate failure
	1600 psi	Shear, Stainless (321)
	1700 psi	Shear, Aluminum (2024-T3)
	1800 psi	Shear, Rigid PVC/PVC substrate failure
	2000 psi	Shear, Plywood/plywood substrate failure
	2400 psi	Shear, Carbon Steel

Descriptive Properties
Color	Tan	Part A
	Tan	Part B
	Tan	Mixed
Mix Ratio	1:1	Volume
	100:107.5	Weight

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PCYTED014 / 180316

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