| Test specimens were transfer molded and post cured 4 hours at 175°C. A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. Excellent low stress properties; Consistent moldability (low viscosity, easy of mold filling, fast cycles and good hot hardness); Outstanding cosmetics and markability; Superior reliability |
