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Ensinger PEI

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Cookson Group STAYSTIK® 682 Aluminum Nitride Filled Thermally Enhanced Film  (discontinued **)
Categories: Polymer; Adhesive; Film; Thermoplastic

Material Notes: These thermoplastic adhesive films are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding. These films can be used for die attach and/or substrate attach in hybrid or Multi-Chip Modules (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features:

  • Fully polymerized resin - No "cure"
  • Easily reworkable - No outgassing
  • Bonds in seconds - Not hours or minutes
  • Low modulus reduces stress to bonded materials

Information provided by Cookson Electronics

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Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity >= 350 ksi
Adhesive Bond Strength >= 2500 psiDie shear adhesion, at 25°C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+9 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity >= 1.00 W/m-K
Maximum Service Temperature, Air 150 °CContinuous use
 <= 300 °CExcursion Temperature
Minimum Service Temperature, Air -65.0 °CContinuous use
Glass Transition Temp, Tg >= 98.0 °C
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 Monthat 25°C
 
Descriptive Properties
Attach Temperature160-275°C
Filler MaterialAluminum Nitride

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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