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Elmet Technologies

Arlon Electronic Materials 33N Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: High reliability and high temperature material

33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service.

  • Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened. Non-MDA chemistry resists drill cracking
  • Compatible with lead-free processing
  • RoHS/WEEE compliant

Typical Applications:

  • PCBs that are subjected to high temperatures during processing, such as lead-free soldering
  • Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.

Information provided by ARLON Electronic Materials.

Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 1.60 g/cc0.0578 lb/in³ASTM D792 Method A
Water Absorption 0.21 %0.21 %IPC TM-650 2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 22.1 GPa3200 ksiIPC TM-650 2.4.18.3
Poissons Ratio 0.150.15ASTM D3039
Peel Strength 1.26 kN/m7.20 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 1.26 kN/m7.20 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 1.31 kN/m7.50 pliTo Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.20e+13 ohm-cm7.20e+13 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
 4.50e+14 ohm-cm4.50e+14 ohm-cmE24/125; IPC TM-650 2.5.17.1
Surface Resistance 4.10e+14 ohm4.10e+14 ohmC96/35/90; IPC TM-650 2.5.17.1
 1.60e+15 ohm1.60e+15 ohmE24/125; IPC TM-650 2.5.17.1
Dielectric Constant 4.0
@Frequency 1e+6 Hz
4.0
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
Dielectric Strength 50.8 kV/mm1290 kV/inIPC TM-650 2.5.6.2
Dissipation Factor 0.010
@Frequency 1e+6 Hz
0.010
@Frequency 1e+6 Hz
IPC TM-650 2.5.5.3
Arc Resistance 170 sec170 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 16.0 - 17.0 µm/m-°C8.89 - 9.44 µin/in-°FIPC TM-650 2.4.41
CTE, linear, Transverse to Flow  55.0 µm/m-°C
@Temperature <=250 °C
30.6 µin/in-°F
@Temperature <=482 °F
z (< Tg); IPC TM-650 2.4.24
 164 µm/m-°C
@Temperature >=250 °C
91.1 µin/in-°F
@Temperature >=482 °F
z (> Tg); IPC TM-650 2.4.24
Thermal Conductivity 0.200 W/m-K1.39 BTU-in/hr-ft²-°FASTM E1461
Glass Transition Temp, Tg 250 °C482 °FTMA; IPC TM-650 2.4.24
Decomposition Temperature 353 °C667 °FOnset; IPC TM-650 2.4.24.6
 389 °C732 °F5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)23IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)8IPC TM-650 2.4.24.1
Z-Axis Expansion (%)1.2IPC TM-650 2.4.24 (50-260°C)

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