High reliability and high temperature material 33N is a flame retardant polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg results in low overall processing and minimizes risk of latent PTH defects in-service. - Low Z-expansion minimizes the risk of PTH defects caused during solder reflow and device attachment
- Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
- Toughened. Non-MDA chemistry resists drill cracking
- Compatible with lead-free processing
- RoHS/WEEE compliant
Typical Applications: - PCBs that are subjected to high temperatures during processing, such as lead-free soldering
- Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors.
Information provided by ARLON Electronic Materials. |