TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. Information provided by Tra-Con Inc. |