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Metal adhesives

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Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes: Long work life, thermally conductive urethane adhesive
DIS-A-PASTE 2003-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2003A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Exceeds NASA outgassing requirements for high vacuum environments. Bonds DAT-A-THERM 1000 film to devices and substrates without loss of thermal conductivity. Available in pre-mixed frozen syringes. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2003A-.010/B.

DIS-A-PASTE 2003-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2003-B is a clear, organic isocyanate.

Information provided by Aptek Laboratories, Inc.
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Physical PropertiesOriginal ValueComments
Density 1.07 - 1.70 g/ccB Component; ASTM D1475
 2.08 - 2.18 g/ccA Component; ASTM D1475
Viscosity 2700 cPB Component; ASTM D1824
 150000 cPA Component; ASTM D1824
Outgassing - Total Mass Loss 0.27 %Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.0050 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 80Cured property; ASTM D2240
Tensile Strength, Ultimate 450 psiCured property; ASTM D638
Elongation at Break 90 %Cured property; ASTM D638
Adhesive Bond Strength 260 psiAl-to-Al Lap Shear; Cured property; ASTM D1002
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 5.4
@Frequency 1000 Hz		Cured property; ASTM D150
Dielectric Strength 620 V/mil
@Thickness 1.27 mm		Cured; ASTM D149
Dissipation Factor 0.016
@Frequency 1000 Hz		Cured property; ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 31.0 µm/m-°C
@Temperature 20.0 °C		Cured property; alpha 1
 137 µm/m-°C
@Temperature 20.0 °C		Cured property; alpha 2
Thermal Conductivity 5.16 BTU-in/hr-ft²-°FCured property; COLORA
Glass Transition Temp, Tg -60.0 °CCured property; JMTP P-200
Flash Point >= 150 °CB Component; ASTM D92
 >= 200 °CA Component; ASTM D92
 
Processing PropertiesOriginal ValueComments
Processing Temperature 85.0 °CCure 6 hrs
 100 °CCure 4 hrs
 125 °CCure 2 hrs

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PAPTEK02 / 24164

Metal adhesives




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