| CHO-THERM® 1680 thermal interface insulators efficiently transfer heat away from mounted components with out the need for clamping force. These pads have a high tack, pressure-sensitive adhesive on one or both sides. This configuration is optimized for mounting multichip modules and other surface mount components to PBCs. CHO-THERM® 1680 thermal pads are composed of a polyimide film beneath a layer of boron nitride-filled silicone, with adhesive on one or both sides. The 0.001 in. thick polyimide film offers excellent resistance to cut-through. The film is coated on one side with a resilient boron nitride-filled silicone, providing an effective thermal path. The adhesive bonds components to provide good heat transfer under low mounting pressures. This is especially useful in applications such as hybrid, ceramic, and flat packages.Information provided by Chomerics |
