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Rogers Arlon CuClad 250 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes: CuClad 250 uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directions are other significant benefits. The electrical properties of CuClad 250GT and CuClad250GX are tested at 1 MHz and 10GHz respectively.
  • Cross Plied Woven Fiberglass, alternating plies are oriented 90° to each other
  • High PTFE to Glass Ratio
  • Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates

Benefits:

  • Electrical and Mechanical isotropy in the X-Y Plane
  • Extremely Low Loss
  • Well Suited for Er Sensitive Circuits

Typical Applications:

  • Military Electronics (Radars, ECM, ESM)
  • Microwave Components (Filters, Couplers, LNAs, etc.)

Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesOriginal ValueComments
Density 2.31 g/ccASTM D792 Method A
Water Absorption 0.030 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
Collected Volatile Condensable Material 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C		NASA SP-R-0022A
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 20500 psiCross; ASTM D882
 26000 psiMachine; ASTM D882
Modulus of Elasticity 572 ksiCross; ASTM D638
 725 ksiMachine; ASTM D638
Flexural Modulus >= 456 ksiASTM D790
Compressive Modulus 342 ksiASTM D695
Peel Strength 14.0 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.00e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 1.50e+14 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 2.4 - 2.6
@Frequency 1e+6 Hz		C23/50; IPC TM-650 2.5.5.3
 2.4 - 2.6
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 VD48/50; ASTM D149
Dissipation Factor 0.0018
@Frequency 1e+10 Hz		C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 secD48/50; ASTM D495
 
Thermal PropertiesOriginal ValueComments
CTE, linear 18.0 µm/m-°C
@Temperature 0.000 - 100 °C		x direction; IPC TM-650 2.4.24
 19.0 µm/m-°C
@Temperature 0.000 - 100 °C		y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 177 µm/m-°C
@Temperature 0.000 - 100 °C		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.254 W/m-K
@Temperature 100 °C		ASTM E1225
Flammability, UL94 V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-170IPC TM-650 2.5.5.5 (-10 - 140°C)

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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