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Metal adhesives

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Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP1112, which utilizes a higher molecular weight aromatic diluent to significantly reduce the tendency for crystallization in the epoxy resin. It cures completely at room temperature to a tough, flexible polymer. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are also enhanced by its high elongation giving it the ability to absorb difference in CTE's of substrates. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1112NC Clear will reach full cure at room temperature within 6 to 12 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 10 minutes at 100°C are typical for small castings (less than 50 grams).

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.960 g/ccPart B; TM R050-16
 1.04 g/ccMixed; TM R050-16
 1.12 g/ccPart A; TM R050-16
Water Absorption 0.40 %
@Time 86400 sec
TM R050-35
Viscosity 1200 cPPart A, RVT, #2, 20 rpm; TM R050-12
 1200 cPPart B, RVT, #2, 20 rpm; TM R050-12
 1200 cPMixed; TM R050-12
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 70TM R050-17
Tensile Strength at Break 1600 psiTM R050-36
Tensile Strength, Ultimate 1700 psiTM R050-36
Tensile Strength, Yield 900 psiTM R050-36
Elongation at Break 50 %TM R050-36
Tensile Modulus 60.0 ksiTM R050-36
Compressive Yield Strength 1200 psiTM R050-38
Compressive Strength 18000 psiBreak; TM R050-38
 18500 psiUltimate; TM R050-38
Compressive Modulus 70.0 ksiTM R050-38
Adhesive Bond Strength 1000 psiLap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.00e+14 ohm-cm
Dielectric Constant 4.2
@Frequency 100 Hz,
Temperature 25.0 °C
Dielectric Strength 410 V/mil
 
Thermal PropertiesOriginal ValueComments
CTE, linear 60.0 µm/m-°C
Thermal Conductivity 0.140 W/m-K
Maximum Service Temperature, Air 121 °C
Minimum Service Temperature, Air -40.0 °C
Glass Transition Temp, Tg 48.0 °CTM R050-25
 
Optical PropertiesOriginal ValueComments
Transmission, Visible 90 %clear; thickness not quantified
 
Processing PropertiesOriginal ValueComments
Pot Life 8.0 - 12 minMass: 50g; TM R050-19
 
Descriptive Properties
ColorClear
Mix Ratio1:1Volume
 100:85Weight

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