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Morgan Advanced Ceramics Alumina AL998A Aluminum Oxide Ceramic
Categories: Ceramic; Oxide; Aluminum Oxide
Material Notes: High purity alumina with a minimum purity of 99.8%. Specifically developed for semiconductor processing applications.

Prime Features:

  • High resistance to semiconductor etch chemistries
  • Excellent chemical resistance to acids, bases and organics
  • Small grain size, low porosity, high polishability. High volume resistivity
  • Superior mechanical wear resistance
  • Less than 100 ppm soda and silica impurity levels
  • Maintains surface integrity in corrosive environments
Typical applications:
  • Semiconductor components for etch, PVD, CVD, CMP, implant and litho processes
  • High power laser insulators
  • Wear-resistant rotary components
  • Blood seals and valves
  • Piston & sleeve pump sets
  • High vacuum components
Production Capabilities:
  • Process application suppori
  • Isostatic, monostatic & uniaxial pressing
  • Lapping & polishing to 2 microinch Ra
  • Manual, CNC and high precision machining
  • Straight right cylinder straightness to <10 microinch per inch and roundness to <20 microinches

Information provided by Morgan Advanced Materials
Key Words: AL998A
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 3.94 g/cc0.142 lb/in³ASTM C373
Water Absorption >= 0.0040 %>= 0.0040 %ASTM C373
Grain Size >= 6.0 µm>= 6.0 µmASTM E112-96
Permeability >= 1.0e-10>= 1.0e-10Torr-L/sec; He Leak detection
Weibull Modulus 2525ASTM C1161, C1239
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell HR45N 8686
Modulus of Elasticity 391 GPa56700 ksiASTM C848
Flexural Strength 361 MPa
@Temperature 20.0 °C		52400 psi
@Temperature 68.0 °F		3-point bend
Poissons Ratio 0.190.19ASTM C848
Fracture Toughness 4.30 - 4.60 MPa-m½3.91 - 4.19 ksi-in½NIST Indentation
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  4.00e+7 ohm-cm
@Temperature 700 °C		4.00e+7 ohm-cm
@Temperature 1290 °F		ASTM D257
 4.00e+11 ohm-cm
@Temperature 300 °C		4.00e+11 ohm-cm
@Temperature 572 °F		ASTM D257
 1.00e+14 ohm-cm
@Temperature 20.0 °C		1.00e+14 ohm-cm
@Temperature 68.0 °F		ASTM D257
Dielectric Constant 9.6
@Frequency 1e+6 Hz		9.6
@Frequency 1e+6 Hz		ASTM D2520
Dielectric Strength >= 23.0 kV/mm>= 584 kV/inASTM D149
Dissipation Factor 0.00030
@Frequency 1e+6 Hz		0.00030
@Frequency 1e+6 Hz		ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  7.40 µm/m-°C
@Temperature 40.0 - 400 °C		4.11 µin/in-°F
@Temperature 104 - 752 °F		ASTM C372
 8.10 µm/m-°C
@Temperature 40.0 - 800 °C		4.50 µin/in-°F
@Temperature 104 - 1470 °F		ASTM C372
Specific Heat Capacity 0.911 J/g-°C
@Temperature 100 °C		0.218 BTU/lb-°F
@Temperature 212 °F		ASTM E1461
Thermal Conductivity 27.0 W/m-K
@Temperature 100 °C		187 BTU-in/hr-ft²-°F
@Temperature 212 °F		ASTM C408
 
Component Elements PropertiesMetricEnglishComments
Al2O3 >= 99.8 %>= 99.8 %
 
Descriptive Properties
Colorivory
Content<100 ppmImpurities (as SiO2)
Inclusions0, 3x visual, .0.8mm dia
Thermal Shock ResistanceΔT = 212°CASTM C1525

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CMORF5018 / 200256

Specialty Compounds RTP Company




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