Epoxy Technology EPO-TEK® 930-1 Thermally Conductive, Electrically Insulating Epoxy

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Epoxy Technology EPO-TEK® 930-1 Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics or medical devices. It is a lower viscosity and smaller particle size alternative to EPO-TEK® 930. Information Provided by Epoxy Technology
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.03 g/cc	1.03 g/cc	Part B
	1.40 g/cc	1.40 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	60000 - 80000 cP @Temperature 23.0 °C	60000 - 80000 cP @Temperature 73.4 °F	5 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82
Tensile Modulus	5.47 GPa	793 ksi	Storage
Shear Strength	11.28 MPa	1636 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm
Dielectric Constant	3.99 @Frequency 1000 Hz	3.99 @Frequency 1000 Hz
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	28.0 µm/m-°C	15.6 µin/in-°F	Below Tg
	96.0 µm/m-°C	53.3 µin/in-°F	Above Tg
Thermal Conductivity	1.07 W/m-K	7.43 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 70.0 °C	>= 158 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	412 °C	774 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	10.0 min @Temperature 150 °C	0.167 hour @Temperature 302 °F	minimum
	360 min @Temperature 80.0 °C	6.00 hour @Temperature 176 °F	minimum
Pot Life	1440 min	1440 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Amber		Part B
	White		Part A
Consistency	Smooth paste
Mix Ratio by Weight	100:4
Number of Components	Two
Thixotropic Index	3.8
Weight Loss	0.09%		200°C
	0.5%		250°C
	1.31%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Epoxy Technology EPO-TEK® H61LV Thermally Conductive, Electrically Insulating Epoxy
Epoxy Technology EPO-TEK® H61ND Thermally Conductive, Electrically Insulating Epoxy
Epoxy Technology EPO-TEK® H63 Thermally Conductive, Electrically Insulating Epoxy
Epoxy Technology EPO-TEK® B9021-13 Thermally Conductive, Electrically Insulating Epoxy
Epoxy Technology EPO-TEK® H67MP-GB Thermally Conductive, Electrically Insulating Epoxy

PPOXYT058 / 141097

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message