Epoxy Technology EPO-TEK® H67MP-GB Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® H67MP-GB Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Preliminary Product Information Sheet Material Description: A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.00 g/cc	2.00 g/cc
Particle Size	<= 55 µm	<= 55 µm
Viscosity	334200 cP @Temperature 23.0 °C	334200 cP @Temperature 73.4 °F	1 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	<= 50 ppm	<= 50 ppm
Ionic Impurities - K (Potassium)	<= 50 ppm	<= 50 ppm
Ionic Impurities - Cl (Chloride)	<= 200 ppm	<= 200 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	86	86
Tensile Modulus	5.8765 GPa	852.31 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 2.00e+13 ohm-cm	>= 2.00e+13 ohm-cm
Dielectric Constant	5.01 @Frequency 1000 Hz	5.01 @Frequency 1000 Hz
Dissipation Factor	0.0045 @Frequency 1000 Hz	0.0045 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	17.0 µm/m-°C	9.44 µin/in-°F	Below Tg
	75.0 µm/m-°C	41.7 µin/in-°F	Above Tg
Thermal Conductivity	0.430 W/m-K	2.98 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 93.0 °C	>= 199 °F
Decomposition Temperature	360 °C	680 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	Minimum Bond Line
Pot Life	40320 min	40320 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties
Color	White
Consistency	Highly viscous paste
Ionic Impurities NH₄	44 ppm
Number of Components	Single
Weight Loss	0.29%		200°C
	0.79%		250°C
	1.62%		300°C

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PPOXYT069 / 141108

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