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Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE); Polytetrafluoroethylene (PTFE), Glass Filled, Molded

Material Notes: RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final circuit applications.

The dielectric constant of RT/duroid laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above.

RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.
Available with a range of copper cladding options.

Features:

  • Lowest electrical loss for reinforced PTFE material
  • Low moisture absorption
  • Isotropic
  • Uniform electrical properties over frequency
  • Excellent chemical resistance
  • Lead free process compatible

Typical Applications:

  • Commercial Airline Telephones
  • Microstrip and Stripline Circuits
  • Millimeter Wave Applications
  • Military Radar Systems
  • Missile Guidance Systems
  • Point to Point Digital Radio Antennas

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 2.20 g/ccASTM D792
Moisture Absorption at Equilibrium 0.020 %
@Thickness 1.57 mm
D48/50; ASTM D570
Thickness 5.00 - 125 milRange of Thicknesses Available
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 34.0 MPa
@Temperature 100 °C
X direction, Condition A; ASTM D638
 34.0 MPa
@Temperature 100 °C
Y direction, Condition A; ASTM D638
 42.0 MPa
@Temperature 23.0 °C
Y direction, Condition A; ASTM D638
 50.0 MPa
@Temperature 23.0 °C
X direction, Condition A; ASTM D638
Elongation at Break 8.6 %
@Temperature 100 °C
Y direction, Condition A; ASTM D638
 8.7 %
@Temperature 100 °C
X direction, Condition A; ASTM D638
 9.8 %
@Temperature 23.0 °C
X direction, Condition A; ASTM D638
 9.8 %
@Temperature 23.0 °C
Y direction, Condition A; ASTM D638
Tensile Modulus 63.0 ksi
@Temperature 100 °C
Y direction; ASTM D638
 71.0 ksi
@Temperature 100 °C
X direction; ASTM D638
 185 ksi
@Temperature 23.0 °C
Y direction; ASTM D638
 189 ksi
@Temperature 23.0 °C
X direction; ASTM D638
Compressive Strength 23.0 MPa
@Strain 4.3 %,
Temperature 100 °C
X direction, Condition A; ASTM D695
 25.0 MPa
@Strain 3.3 %,
Temperature 100 °C
Y direction, Condition A; ASTM D695
 30.0 MPa
@Strain 4 %,
Temperature 23.0 °C
X direction, Condition A; ASTM D695
 37.0 MPa
@Strain 3.3 %,
Temperature 23.0 °C
Y direction, Condition A; ASTM D695
 37.0 MPa
@Strain 8.5 %,
Temperature 100 °C
Z direction, Condition A; ASTM D695
 54.0 MPa
@Strain 8.7 %,
Temperature 23.0 °C
Z direction, Condition A; ASTM D695
Compressive Modulus 520 MPa
@Temperature 100 °C
Z direction, Condition A; ASTM D695
 680 MPa
@Temperature 100 °C
X direction, Condition A; ASTM D695
 803 MPa
@Temperature 23.0 °C
Z direction, Condition A; ASTM D695
 860 MPa
@Temperature 100 °C
Y direction, Condition A; ASTM D695
 1210 MPa
@Temperature 23.0 °C
X direction, Condition A; ASTM D695
 1360 MPa
@Temperature 23.0 °C
Y direction, Condition A; ASTM D695
Peel Strength 27.2 pli1 oz EDC foil; after solder float; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.00e+13 ohm-cmZ direction; C96/35/90; ASTM D257
Surface Resistance 2.00e+13 ohmZ direction; C96/35/90; ASTM D257
Dielectric Constant 2.31 - 2.35
@Frequency 1e+10 Hz
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 2.33
@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Dissipation Factor 0.00050
@Frequency 1e+6 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.3
 0.0012
@Frequency 1e+10 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 µm/m-°C
@Temperature 0.000 - 100 °C
X-Direction; IPC-TM-650 2.4.41
 28.0 µm/m-°C
@Temperature 0.000 - 100 °C
Y-Direction; IPC-TM-650 2.4.41
 173 µm/m-°C
@Temperature 0.000 - 100 °C
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.960 J/g-°Ccalculated
Thermal Conductivity 0.220 W/m-K
@Temperature 80.0 °C
Z direction; ASTM C518
Deflection Temperature at 1.8 MPa (264 psi) >= 260 °CX, Y direction; ASTM D648
Decomposition Temperature 500 °CTGA; ASTM D3850
Flammability, UL94 V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-115 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C

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