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Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE); Polytetrafluoroethylene (PTFE), Glass Filled, Molded

Material Notes: RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final circuit applications.

The dielectric constant of RT/duroid laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above.

RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.
Available with a range of copper cladding options.

Features:

  • Lowest electrical loss for reinforced PTFE material
  • Low moisture absorption
  • Isotropic
  • Uniform electrical properties over frequency
  • Excellent chemical resistance
  • Lead free process compatible

Typical Applications:

  • Commercial Airline Telephones
  • Microstrip and Stripline Circuits
  • Millimeter Wave Applications
  • Military Radar Systems
  • Missile Guidance Systems
  • Point to Point Digital Radio Antennas

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 2.20 g/ccASTM D792
Moisture Absorption at Equilibrium 0.020 %
@Thickness 1.57 mm
D48/50; ASTM D570
Thickness 5.00 - 125 milRange of Thicknesses Available
Deformation 1.0 %
@Pressure 14.0 MPa,
Temperature 150 °C
Z direction; 24 hrs; ASTM D621
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 18.0 MPa
@Temperature 100 °C
Y direction, Condition A; ASTM D638
 20.0 MPa
@Temperature 100 °C
X direction, Condition A; ASTM D638
 27.0 MPa
@Temperature 23.0 °C
Y direction, Condition A; ASTM D638
 29.0 MPa
@Temperature 23.0 °C
X direction, Condition A; ASTM D638
Elongation at Break 4.9 %
@Temperature 23.0 °C
Y direction, Condition A; ASTM D638
 5.8 %
@Temperature 100 °C
Y direction, Condition A; ASTM D638
 6.0 %
@Temperature 23.0 °C
X direction, Condition A; ASTM D638
 7.2 %
@Temperature 100 °C
X direction, Condition A; ASTM D638
Tensile Modulus 55.0 ksi
@Temperature 100 °C
Y direction; ASTM D638
 65.0 ksi
@Temperature 100 °C
X direction; ASTM D638
 125 ksi
@Temperature 23.0 °C
Y direction; ASTM D638
 156 ksi
@Temperature 23.0 °C
X direction; ASTM D638
Compressive Strength 21.0 MPa
@Strain 7.8 %,
Temperature 100 °C
Y direction, Condition A; ASTM D695
 22.0 MPa
@Strain 8.4 %,
Temperature 100 °C
X direction, Condition A; ASTM D695
 27.0 MPa
@Strain 8.5 %,
Temperature 23.0 °C
X direction, Condition A; ASTM D695
 29.0 MPa
@Strain 7.7 %,
Temperature 23.0 °C
Y direction, Condition A; ASTM D695
 43.0 MPa
@Strain 17.6 %,
Temperature 100 °C
Z direction, Condition A; ASTM D695
 52.0 MPa
@Strain 12.5 %,
Temperature 23.0 °C
Z direction, Condition A; ASTM D695
Compressive Modulus 500 MPa
@Temperature 100 °C
X direction, Condition A; ASTM D695
 500 MPa
@Temperature 100 °C
Y direction, Condition A; ASTM D695
 670 MPa
@Temperature 100 °C
Z direction, Condition A; ASTM D695
 710 MPa
@Temperature 23.0 °C
X direction, Condition A; ASTM D695
 710 MPa
@Temperature 23.0 °C
Y direction, Condition A; ASTM D695
 940 MPa
@Temperature 23.0 °C
Z direction, Condition A; ASTM D695
Peel Strength 31.2 pli1 oz EDC foil; after solder float; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.00e+13 ohm-cmZ direction; C96/35/90; ASTM D257
Surface Resistance 3.00e+13 ohmZ direction; C96/35/90; ASTM D257
Dielectric Constant 2.2
@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 2.18 - 2.24
@Frequency 1e+10 Hz
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Dissipation Factor 0.00040
@Frequency 1e+6 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.3
 0.00090
@Frequency 1e+10 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 31.0 µm/m-°C
@Temperature 0.000 - 100 °C
X-Direction; IPC-TM-650 2.4.41
 48.0 µm/m-°C
@Temperature 0.000 - 100 °C
Y-Direction; IPC-TM-650 2.4.41
 237 µm/m-°C
@Temperature 0.000 - 100 °C
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.960 J/g-°Ccalculated
Thermal Conductivity 0.200 W/m-K
@Temperature 80.0 °C
Z direction; ASTM C518
Deflection Temperature at 1.8 MPa (264 psi) >= 260 °CX, Y direction; ASTM D648
Decomposition Temperature 500 °CTGA; ASTM D3850
Flammability, UL94 V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-125 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C

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