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Ensinger PEI

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A. Schulman BMC T15(F) High Strength Grade Molding Compound
Categories: Polymer; Thermoset; Polyester, TS; Polyester (Thermoset) - Rigid

Material Notes: BMC T15F is a high strength, low shrink general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T15F is well suited for injection, transfer or compression molding of intricate parts. Typical applications are circuit breakers, insulators, bobbins and electrical connectors.

Information provided by Bulk Molding Compounds, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.85 - 2.05 g/ccMolded
Linear Mold Shrinkage 0.0020 - 0.0030 in/in
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 30 - 40
Tensile Strength 7600 - 9600 psi
Flexural Strength 15000 - 19000 psi
Flexural Modulus 1100 - 1300 ksi
Compressive Strength 18000 - 22000 psi
Izod Impact, Notched 5.70 - 7.70 ft-lb/in
 
Electrical PropertiesOriginal ValueComments
Dielectric Strength 389 - 439 V/milshort time
Arc Resistance >= 187 sec
Comparative Tracking Index >= 500 V
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) >= 500 °F
Flammability, UL94 V-0
 
Processing PropertiesOriginal ValueComments
Processing Temperature 280 - 330 °F

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